Innovative laser technology for faster, eco-friendly, high-precision marking
About
InPhocal uses a unique laser beam technology that will revolutionize the field of laser processing. The long focus depth of its beam will speed up laser marking systems. The long focus depth also allows for marking on curved surfaces without loss in quality. The laser beam can also be focused down to smaller spot sizes than current technology. This results in higher precision for wafer dicing. This increases chip yield and can help solving our current global chip shortage problem.
Solution
Inefficient and limited laser marking capabilities
Innovative laser technology for faster, eco-friendly, high-precision marking
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CEO & CTO at inPhocal
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Testimonial
“I think HighTechXL has been instrumental in the success of inPhocal. Firstly, because they have access to CERN, and through that, we were able to access the CERN patent that we are now using for our technology. But also in supplying us with the first support in building the company by offering office space, to helping us find some subsidies we were looking for, to put the network in place and to help us facilitate any potential challenge that we had by putting us in contact with the right person at the right time.”
CEO & Co-founder at inPhocal, InPhocal
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